對(duì)于剛進(jìn)入PCB行業(yè)，許多英文縮寫就像天書，讓人晦澀難懂，因此深亞電子整理了100個(gè)PCB中常用的英文縮寫、全稱及中文名供大家學(xué)習(xí)：

1.PCB - Printed Circuit Board - 印刷電路板
2.SMT - Surface Mount Technology - 表面貼裝技術(shù)
3.BGA - Ball Grid Array - 球柵陣列
4.DFM - Design for Manufacturability - 可制造性設(shè)計(jì)
5.DFT - Design for Testability - 可測(cè)試性設(shè)計(jì)
6.EMI - Electromagnetic Interference - 電磁干擾
7.EMC - Electromagnetic Compatibility - 電磁兼容性
8.HAL - Hot Air Leveling - 熱風(fēng)熔錫
9.HASL - Hot Air Solder Leveling - 熱風(fēng)焊錫平整
10.ICT - In-Circuit Test - 板級(jí)測(cè)試
11.FCT - Functional Circuit Test - 功能電路測(cè)試
12.AOI - Automated Optical Inspection - 自動(dòng)光學(xué)檢測(cè)
13.X-ray - X-ray Inspection - X射線檢測(cè)
14.ESD - Electrostatic Discharge - 靜電放電
15.LED - Light Emitting Diode - 發(fā)光二極管
16.BOM - Bill Of Materials - 物料清單
17.CAD - Computer-Aided Design - 計(jì)算機(jī)輔助設(shè)計(jì)
18.CAM - Computer-Aided Manufacturing - 計(jì)算機(jī)輔助制造
19.CNC - Computer Numerical Control - 計(jì)算機(jī)數(shù)控
20.ROHS - Restriction of Hazardous Substances - 有害物質(zhì)限制
21.NRE - Non-Recurring Engineering - 非重復(fù)工程
22.PTH - Plated Through-Hole - 過(guò)孔
23.THT - Through-Hole Technology - 穿孔技術(shù)
24.MCPCB - Metal Core Printed Circuit Board - 金屬基板印刷電路板
25.HDI - High Density Interconnect - 高密度互連
26.OSP - Organic Solderability Preservatives - 有機(jī)釬焊保護(hù)劑
27.RF - Radio Frequency - 射頻
28.Vias - Vertical Interconnect Access - 垂直互連孔
29.LVDS - Low Voltage Differential Signaling - 低壓差分信號(hào)傳輸
30.EDA - Electronic Design Automation - 電子設(shè)計(jì)自動(dòng)化
31.FPC - Flexible Printed Circuit - 柔性印刷電路板
32.IPC - Institute for Printed Circuits - 印制電路協(xié)會(huì)
33.LGA - Land Grid Array - 焊盤陣列
34.MCM - Multi-Chip Module - 多芯片模塊
35.DDR - Double Data Rate - 雙倍數(shù)據(jù)傳輸率
36.RAM - Random Access Memory - 隨機(jī)存取存儲(chǔ)器
37.ROM - Read-Only Memory - 只讀存儲(chǔ)器
38.TDR - Time Domain Reflectometry - 時(shí)域反射法
39.DRC - Design Rule Check - 設(shè)計(jì)規(guī)則檢查
40.VRM - Voltage Regulator Module - 電壓調(diào)節(jié)模塊
41.PBC - Polychlorinated Biphenyls - 多氯聯(lián)苯
42.PWM - Pulse Width Modulation - 脈寬調(diào)制
43.LPI - Liquid Photo-Imageable - 液體感光油墨
44.ERP - Enterprise Resource Planning - 企業(yè)資源規(guī)劃
45.CRM - Customer Relationship Management - 客戶關(guān)系管理
46.CAD/CAM - Computer-Aided Design/Computer-Aided Manufacturing - 計(jì)算機(jī)輔助設(shè)計(jì)/制造
47.DIP - Dual In-line Package - 雙列直插封裝
48.IC - Integrated Circuit - 集成電路
49.FPGA - Field Programmable Gate Array - 現(xiàn)場(chǎng)可編程門陣列
50.ASIC - Application-Specific Integrated Circuit - 特定應(yīng)用集成電路
51.RD - Research and Development - 研發(fā)
52.EDA - Electronic Design Automation - 電子設(shè)計(jì)自動(dòng)化
53.CEM - Contract Electronics Manufacturer - 合同電子制造商
54.PWB - Printed Wiring Board - 印刷布線板
55.P&P - Pick and Place - 取放設(shè)備
56.SMD - Surface Mount Device - 表面貼裝器件
57.MSL - Moisture Sensitivity Level - 濕敏等級(jí)
58.OEE - Overall Equipment Effectiveness - 設(shè)備綜合效率
59.RFQ - Request for Quotation - 報(bào)價(jià)請(qǐng)求
60.PMS - Process Management System - 過(guò)程管理系統(tǒng)
61.ESD - Electrostatic Discharge - 靜電釋放
62.PNP - Positive-Negative-Positive - 正負(fù)正結(jié)構(gòu)
63.SPC - Statistical Process Control - 統(tǒng)計(jì)過(guò)程控制
64.SMTA - Surface Mount Technology Association - 表面貼裝技術(shù)協(xié)會(huì)
65.UL - Underwriters Laboratories - 安捷倫實(shí)驗(yàn)室
66.WIP - Work in Progress - 在制品
67.COB - Chip on Board - 芯片貼片
68.DIP - Dual Inline Pin - 雙列直插引腳
69.FIFO - First In, First Out - 先進(jìn)先出
70.GND - Ground - 地線
71.IPQC - In-Process Quality Control - 過(guò)程中的質(zhì)量控制
72.LCR - Leadless Chip Resistor - 無(wú)引線片式電阻
73.MTBF - Mean Time Between Failures - 故障平均時(shí)間間隔
74.NPI - New Product Introduction - 新產(chǎn)品導(dǎo)入
75.PCBA - Printed Circuit Board Assembly - 印刷電路板組裝
76.PPM - Parts Per Million - 百萬(wàn)分之一
77.QFN - Quad Flat No-Leads - 方形無(wú)引腳封裝
78.RMA - Return Merchandise Authorization - 退貨授權(quán)
79.SPC - Statistical Process Control - 統(tǒng)計(jì)過(guò)程控制
80.THT - Through-Hole Technology - 穿孔技術(shù)
81.TRM - Technical Reference Manual - 技術(shù)參考手冊(cè)
82.UPS - Uninterruptible Power Supply - 不間斷電源
83.VPP - Verification and Production Prototype - 驗(yàn)證和生產(chǎn)原型
84.WEEE - Waste Electrical and Electronic Equipment - 廢棄電子電器設(shè)備
85.PPF - Process Performance Factor - 工藝性能因子
86.PNP - Positive-Negative-Positive - 正-負(fù)-正結(jié)構(gòu)
87.UUT - Unit Under Test - 被測(cè)單元
88.ZIF - Zero Insertion Force - 零插入力
89.Cpk - Process Capability Index - 過(guò)程能力指數(shù)
90.CP - Control Plan - 控制計(jì)劃
91.FMEA - Failure Mode and Effects Analysis - 失效模式和效應(yīng)分析
92.Gage R&R - Gauge Repeatability and Reproducibility - 量具重復(fù)性和再現(xiàn)性
93.LCA - Life Cycle Assessment - 生命周期評(píng)估
94.SMT - Surface Mount Technology - 表面貼裝技術(shù)
95.DFT - Design for Testability - 可測(cè)試性設(shè)計(jì)
96.CEM - Contract Electronics Manufacturer - 合同電子制造商
97.BOM - Bill Of Materials - 物料清單
98.COB - Chip on Board - 芯片貼片
99.FMEA - Failure Mode and Effects Analysis - 失效模式和效應(yīng)分析
100.LCA - Life Cycle Assessment - 生命周期評(píng)估

        以上是深亞電子整理的一些在 PCB 領(lǐng)域中常見(jiàn)的英文縮寫及其全稱，希望對(duì)你有所幫助。 

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